DEVICE FOR VACUUM TREATMENT AND DEVICE FOR AND METHOD OF FILM FORMATION USING SAID DEVICE

摘要

A vacuum treatment device for conducting various treatments of wafers in a vacuum tank and a method of film formation using said device, which is characterized in that temperature control of the wafers during film formation is performed using a radiation thermometer and, in particular, wafers are conveyed to each stage in a vacuum film forming chamber after emissivities thereof are corrected by a temperature correction stage in combination with the shutter, and are temperature-controlled to a fixed temperature to form a film thereon.