| 摘要 |
PURPOSE:To enhance the heat dissipating efficiecy of a package by a method wherein a semiconductor chip is brazed to a metallic bottom plate, and the package is composed of this plate, a ceramic frame, and a metallic cap; then, a coolant solution is sealed in the package. CONSTITUTION:The metallic bottom plate 3 made of a low-thermal-expansion alloy or the like having a coefficient of thermal expansion close to that of the ceramic frame 2 is brazed to the metallized layer 5 of the frame 2 with a solder 5. Next, a semiconductor chip 7 is die-bonded on the bottom plate 3 with a solder 8. Then, the chip 7 is connected to the frame 2 with wires 10. The low- boiling-point coolant solution 9 is put in the package 1, and the metallic cap 4 is brazed to the metallized layer of the frame 2 and hermetically sealed. Finally, leads 11 installed outside the wiring layer of the frame 2 are fixed to the circuit board. |
