| 摘要 |
PURPOSE:To form the projector to a smaller size and lighter weight and to obtain a projected image which is higher in grade and is uniform by providing a plate member which is adhered or press-welded to the rear surface of an active matrix substrate and has the thermal conductivity higher than the thermal conductivity of the active matrix and a mechanism for cooling the plate member by the forced air flow of the machine body. CONSTITUTION:The plate member 5 having the thermal conductivity higher than the thermal conductivity of the semiconductor substrate 3 is press-welded to an LCD 1 having the semiconductor substrate 3 as one substrate. The plate member 5 is formed by forming a heat sink on the side face of a thick film plate consisting of beryllia (BeO), silicon carbide (SiC), copper (Cu), molybdenum (Mo), etc., then thinly cutting the part to be press-welded with the LCD 1 by a milling machine, etc. The forced air flow 8 from an axial fan 7 deprives the plate member 5, which is formed thin in order to reduce the thermal resistance of the conduction part, of heat and thereafter the air flow absorbs the further larger heat quantity by the large area and velocity of flow in the heat sink part. The small-sized and lightweight reflection type projector having the high luminance and grade is formed in this way. |
