发明名称 MANUFACTURE OF MUTUAL CONNECTION STRUCTURE ALLOWING WRITING
摘要 <p>PURPOSE: To obtain a writable integrated circuit constitution having a reverse fuse of a small leaked current by forming a reverse fuse substance, put into contact with 1st and 2nd conductors in an aperture formed on an insulating layer on the 1st conductor and using an amorphous silicon film adhesively formed by the used of a plasma-enhanced CVD. CONSTITUTION: A 1st conductor 33 is formed, an insulating layer 34 is formed on the surface of the 1st conductor 33, and an aperture 39 terminated on a part of the 1st conductor 33 is formed on a selected position through the layer 34. Then amorphous silicon film is adhesively formed on the surface of the layer 34 and in the aperture 39 as a pattern by the use of a plasma-enhanced CVD, and an amorphous silicon feature part 35 substantially restricted by the aperture 39 on the selected position and having an area put into contact with the completely superposed to the 1st conductor 33 is formed. Then a 2nd conductor 36 put into partial contact with and superposed to the amorphous silicon area is formed.</p>
申请公布号 JPH03149853(A) 申请公布日期 1991.06.26
申请号 JP19900235968 申请日期 1990.09.07
申请人 PIAA RES INC 发明人 RARUFU JII UITSUTEN;RICHIYAADO ERU BEKUTERU;MAMEN TOOMASU;FUAASAI CHIYUA;ANDORIYUU KEI CHIYAN;JIYON EMU BAAKUNAA
分类号 H01L21/82;H01L23/525;H01L27/10 主分类号 H01L21/82
代理机构 代理人
主权项
地址