发明名称 Semiconductor device having bipolar-MOS composite element pellet suitable for pressure contacted structure.
摘要 <p>A semiconductor device having a bipolar MOS composite element pellet suitable for a compression structure. In this pellet, a semiconductor substrate (10) on which a MOS composite element is formed is electrically connected to an external part by an electrode plate (44, 48, 52) compressed to the substrate (10).</p>
申请公布号 EP0433650(A1) 申请公布日期 1991.06.26
申请号 EP19900121685 申请日期 1990.11.13
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 YOKOTA, YOSHIO, C/O INTELLECTUAL P. DIV.;KITAGAWA, MITSUHIKO, C/O INTELLECTUAL P. DIV.;KARASAWA, DAI, C/O INTELLECTUAL P. DIV.
分类号 H01L23/48;H01L23/482;H01L29/417;H01L29/739 主分类号 H01L23/48
代理机构 代理人
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