| 摘要 |
PURPOSE:To manufacture printed wiring boards continuously and efficiently by laminating and heat and pressure molding a plurality of prepreg groups and a carrier sheet on which conductive circuits are formed by the additive process. CONSTITUTION:A paper base prepared by impregnating a kraft paper with methylol melamine resin is used as a base 1, and a prepreg prepared by applying unsaturated polyester resin for impregnation is transferred to a two-roll mill 3. Separately a polyethylene terephthalate film is passed through a preheater 9, preheated and dried and laminated by laminating rolls 11, and circuit forming image exposure is carried out by an exposure device 12 and developed 13 to remove resist on a conductive circuit forming section and carry out chemical plating. Unnecessary resist is released by a resist release drying oven 15, cleaned and dried, and a bonding agent is applied to a circuit forming carrier sheet 16. Four prepregs and the circuit forming carrier sheet 16 are laminated by the two-roll mill 3 in a manner that a circuit forming surface face the prepregs. The sheet is formed by a heating and pressurizing device 5 and cut by a cutter 6, and the carrier sheet is released to manufacture wiring boards 7. |
