| 摘要 |
PURPOSE:To suppress the change of the characteristics of a semiconductor element caused by the difference in linear expansion coefficient between the components in fixing the semiconductor element to a die pad by making a plurality of protrusions projected on the semiconductor element mount side of the die pad. CONSTITUTION:A plurality of protrusions 8 projected on the side, on which a semiconductor element 11 is to be mounted, are made on the die pad 2 of a lead frame 1 to fix the semiconductor element 11 onto the die pad 2 through bond 10. For example, the surface of the die pad 2 is lowered and at the same time the tips of inner leads 3 are flattened and the protrusions 8 are made on the flat face of the die pad 2 in the flattening. The protrusions 8, for exam ple 30-100mum in height and 150-130mum in diameter, are arranged in matrix form with intervals of 1mm. Thereby the thick silver paste layer 10 formed between the die pad 2 and the semiconductor element 11 absorbs the difference in linear expansion coefficient between the die pad 2 and the semiconductor element 11.
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