| 摘要 |
A three dimensional integrated electronic structure include at least one substrate formed from a laminated stack of ceramic green unfired sheets, at least one of which has a printed circuit formed on its surface. The laminated stack is sintered and electronic devices are mounted on the sintered substrate. The substrate is shaped, formed, moulded or designed so as to provide thereto a predetermined profile suitable for mounting, fixing or locating the structure in a pre-selected enclosure apparatus, machine or the like. The predetermined profile can be given to the structure at any one of three stages in the production process thereof; viz a) before the laminating step; b) during the laminating step, and c) after the laminating step. <IMAGE> |
