| 摘要 |
PURPOSE:To obtain a Cu - polyimide thin multilayer interconnection circuit board allowing a simplified manufacturing process and improved reliability by having an adhesive layer consisting of TiW between a conductive layer and an insulated layer, and by interposing an intermediate layer consisting of Cr between the insulated layer and the adhesive layer. CONSTITUTION:A conductor layer 2 consisting of a Cu thin film and an insulated layer 3 consisting of polyimide are by turns laminated on a board 1 consisting of glass, ceramics or glass ceramics, while coating both surfaces of the conductor layer 2 with an adhesive layer 5 consisting of TiW. Further, an intermediate layer 6 consisting of Cr is provided between an adhesive layer 5 consisting of TiW and the insulated layer 3 consisting of polyimide. In this way, by providing the adhesive layer consisting of TiW between the conductor layer and the insulated layer, etching by means of a positive type resist at the time of forming a conductor pattern is allowed, while by interposing the intermediate layer consisting of Cr between the insulated layer and the adhesive layer, adhesiveness to the insulated layer consisting of TiW can be sharply heightened. |
