A semiconductor device package and a method of manufacture for making it.

摘要

A semiconductor device in which outer leads (4b) adjoining in the direction of arrangement of said outer leads are connected by an insulating material (20) with a predetermined width (d), locally provided only in areas with said predetermined width along said direction of arrangement, and in which areas other than said outer leads and said insulating material are resin-sealed (6). A method for manufacturing a semiconductor device, which has the steps of connecting adjacent outer leads (4b), with an insulating material (20) with a predetermined width (d) locally provided only in areas with said predetermined width along the direction of arrangement of outer leads, and of resin-sealing (6) areas other than said outer leads and said insulating material while preventing the outflow of sealing resin by way of said insulating material.