| 摘要 |
PURPOSE:To allow development without generating corrosion of Al by developing a prescribed resist with an org. solvent. CONSTITUTION:The resist 1 contg. an alkali-soluble resin (e.g.: novolak resin), a dissolution restrainer (e.g.: melamine compd.) and acid generator (e.g.: biphenyl compd.) is applied on the surface of a substrate deposited with a thin film 2 of Al by evaporation on an Si substrate 3 and is heat treated. The resist is then exposed with an electron beam 4 and an org. solvent (e.g.: isobutyl alcohol) is injected from a nozzle 5 to dissolve the unexposed parts. The resist is then rinsed and resist patterns 8 are formed. The patterns are developed by the org. solvent, by which the patterns 8 are formed without corroding the film 2. |
