| 摘要 |
PURPOSE:To improve a mounting density, to reduce the size of a rigid board and to reduce its cost by providing an external connection terminal only in one direction of a flexible board. CONSTITUTION:A package 4 in which memory ICs are mounted on a flexible board with an external connection terminal provided only in one direction has sufficient flexibility. Accordingly, when it is mounted on a glass epoxy board 5, a position except a soldered part can be crossed, and it can be stacked at an oblique angle. As a result, a mounting density can be enhanced, and a mounting thickness is not increased. On the contrary, when the same capacity is mounted, a small rigid board can be used to reduce its cost. |
