| 摘要 |
PURPOSE: To provide an electric circuit package which can be bent geometrically, by, when a supporting member of a thin flexible film material is collectively fused to a substrate material, partially removing the layer of substrate material, for forming a hinge structure with the two parts of the substrate material. CONSTITUTION: A flexible film material 11 of a molding printed circuit package 10 is fused to a rigid substrate material 12. On the film 11, a conductive trace material 14 is printed, where various electronic components such as a transistor 15, a resistor 16, two inline network 18, and a capacitor 19 are connected. For providing hinge's characteristics, as shown at position in 17, a flexibility or hinge region at the part where the film 11 is not fused to the substrate 12 is given. As a result, it is possible to fold into a geometric shape which is different from the fixed-flexible circuit package. |
