| 摘要 |
PURPOSE:To reduce a bonding pad pitch by providing a rectangular dug part right below a bonding pad which connects a metallic wiring layer with a metallic fine line, and providing two passivation films between it and another and neighboring bonding pad. CONSTITUTION:A rectangular dug part 16, at a silicon substrate 1, and first and second passivation films 14 and 15, between it and a neighboring dug part 16, are provided, whereby solid structure is formed. As a result, if bonding is done, the ball of an Au wire 7 is approximately buried in the bonding pad provided at the dug part 16, so it never expands toward a neighboring bonding pad 3, and in the result the ball size can be made small. Hereby, pad pitch P1 can be reduced. |
