| 摘要 |
PURPOSE:To improve flatness of a wafer by so arranging a pedestal in an opening formed in a template that a wafer is rotatable upon rotation of a polishing plate. CONSTITUTION:In a lapping, for example, a lap board is arranged oppositely on a wafer 3. When it is polished by dropping polishing solution to the board surface, a template 2 is rotated at the circumferential speed difference between the inner periphery and the outer periphery of the board. On the other hand, since grooves 6a are formed on a pedestal 5, contact area with a polishing plate 1 is reduced, and it is rotated together with the wafer 3 around its own axis in the rotating direction of the template 2 during polishing. Since the wafer 3 is rotated around its own axis, a taper formed due to an irregularity in pressure is cancelled. Thus, the flatness of the wafer 3 can be improved. |
