| 摘要 |
PURPOSE:To reduce a parasitic inductance of a laser diode and an IC for driver and to enable rapid modulation by arranging a through-wiring plate on a stem and by mounting and wiring the laser diode, a photodiode and the IC for driver on the through-wiring board. CONSTITUTION:A through-hole for part mount is provided to a substrate 61; and a wiring pattern for each signal between a laser diode 1 and an IC 5 for power source and driver and a wiring pattern for output of a photodiode 2 are provided thereon. A metallic heat sink 62 is attached at right angles to a stem 3 to fix and mount the laser diode 1, the photodiode 2 and the IC 5 for driver. A through-wiring board 6 is attached through a wall side of a container, which consists of the heat sink 62, the substrate 61 and an insulator partition wall 63 provided between the photodiode 2 on an upper side of the substrate 61 and the IC 5 for driver. Thereby, it is possible to reduce a parasitic inductance between the laser diode 1 and the IC 5 for driver and to prevent development of waveform distortion during rapid modulation. |
