发明名称 MANUFACTURE OF BUFFER PAD
摘要 PURPOSE:To make it possible to manufacture a buffer pad using only one foaming mold, avoiding thereby the additional use of a conventional trimming jig to remove flashes of a molded item by removing a needless part of the molded item through a cutting hole provided in a cavity of the foaming mold after molding the buffer pad. CONSTITUTION:A cutting hole 12 for use in cutting and removing a needless part 1d of an instrument panel 1 is provided in a cavity 11 of a foaming mold 10, on the side of a skin 1a of said panel 1. A hot blade 15 adapted to be vertically movable along the inner side surface of the hole 12 of the cavity 11 is pressed by means of a drive means such as a hydraulic cylinder against the needless part 1d of the panel 1 to cut said part off. The skin 1a is set on the cavity 11 in which the cutting hole 12 is provided, while a core material 1b is set on a core 13 of the forming mold on which a blade receiving part 14 is provided so that polyurethane resin is injected into a space between the skin 1a and the core material 1b to effect foaming thereof, thereby a foam polyurethane body 1c is obtained.
申请公布号 JPH03147815(A) 申请公布日期 1991.06.24
申请号 JP19890286077 申请日期 1989.11.02
申请人 HITACHI CHEM CO LTD 发明人 KAKIGI TADASHI
分类号 B29C39/30;B29K105/04;B29L31/58 主分类号 B29C39/30
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