COOLING STRUCTURE FOR SEMICONDUCTOR CONVERTING DEVICE,申请号JP19890286772-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	COOLING STRUCTURE FOR SEMICONDUCTOR CONVERTING DEVICE
摘要
申请公布号	JPH03148160(A)	申请公布日期	1991.06.24
申请号	JP19890286772	申请日期	1989.11.02
申请人	FUJI ELECTRIC CO LTD	发明人	KOMINE KIYOSHI
分类号	H01L23/427	主分类号	H01L23/427
代理机构		代理人
主权项
地址

您可能感兴趣的专利

Hybrid organic-inorganic material constituted by a silica network having photochromic agents and optical power limiting agents as a doping agent in the material

Use of bipolar trans carotenoids as a pretreatment and in the treatment of peripheral vascular disease

Aminoalkylpyrimidine derivatives as histamine H4 receptor antagonists

Heteroaryl compounds useful as inhibitors of E1 activating enzymes

Pyrazolo [3,4-D] pyrimidine derivatives useful to treat respiratory disorders

Low hygroscopic aripiprazole drug substance and processes for the preparation

Pyridazine amide compounds useful as SYK inhibitors

Metalloenzyme inhibitor compounds

Peptide deformylase inhibitors

Selective glycosidase inhibitors and uses thereof

Immunity-inducing agent and method for detection of cancer

Conjugate of hyaluronic acid for cosmetic treatment and preparation method

Compounds and their effects on feeding behaviour

Aqueous cleaning composition for substrate for perpendicular magnetic recording hard disk

Sliding mechanism and friction reduction method for the same

Method for drilling using a drilling and completion fluid comprising a phosphate based blend

Herbicidal compositions comprising 4-amino-3-chloro-5-fluoro-6-(4-chloro-2-fluoro-3-methoxyphenyl) pyridine-2-carboxylic acid or a derivative thereof and cellulose biosynthesis inhibitor herbicides

Stable slurry bed fischer-tropsch catalyst with high surface area and activity

Dark privacy glass

Plasma etch method to reduce micro-loading