| 摘要 |
PURPOSE: To machine micro holes and other shapes accurately by scanning a low power beam and a high power beam combinedly, separating the optical path partially and positioning the high power beam after positioning the low power beam on a workpiece. CONSTITUTION: The machining device 1 combines a low power positioning test beam 26 and a high power machining beam 11 colinearly with a dichroic mirror 30. Then, the colinear combined beam 36 scans along the first axis 62 with a polygonal mirror 35, while a workpiece 55 is moved along the second axis 63 orthogonally crossing the first axis 62. In the meantime, from the optical path of the colinear combined beam 37, the low power beam is split off at least partially by a dichroic mirror 45. Then, the high power beam is positioned, after the place is decided where the high power beam impinges upon the workpiece 55 by means of the low power beam. Further, the device is equipped with a computer 65 and a strip photoelectric detector 60 for the purpose of testing the machining accuracy. |
