APPAREIL ET PROCEDE POUR ETABLIR UNE LIAISON THERMIQUE ENTRE UN BOITIER DE SEMI-CONDUCTEUR ET LA PLAQUE DE REFROIDISSEMENT ET UNE LIAISON ELECTRIQUE ENTRE LES CONDUCTEURS DU BOITIER, ET UN PANNEAU DE CIRCUIT IMPRIME

摘要

The dissipation of the heat is provided for by a dissipator 30 placed beneath a printed circuit board 15. The package 10 containing a component and having conductors 11 which emerge on several sides is positioned on the dissipator 20 so that the conductors 11 can be connected electrically to conductors 16 of the printed circuit, same surrounding two and preferably three sides of the package 10. The package is fixed to the dissipator by an elastic clip. Conduction between the package and the dissipator can be increased by a compressible, heat-conducting material.