| 摘要 |
PURPOSE:To decrease a semiconductor module in mounting area and height so as to enable it to be densely mounted by a method wherein semiconductor elements mounted on a printed board as connected to a wiring pattern are mounted on the peripheral part of another printed board, and a clip lead frame is connected to the semiconductor elements through the intermediary of the wiring pattern. CONSTITUTION:Solder paste is printed on a wiring pattern, a semiconductor element 6 composed of memory ICs is connected to the solder paste printed on both the sides of a printed board 5, a clip 7a of a clip lead frame 7 is fixed to both the lateral ends of the printed board 5 respectively, leads 7b of the clip lead frame 7 are cut adequate in length, and the clips 7a are soldered to clip lead frame connecting solder paste Ps formed on both sides of the printed board 5, whereby a semiconductor module composed of memory ICs can be formed. The leads 7b of the clip lead frame 7 are connected to the wiring pattern of a board 8. |
