| 摘要 |
PURPOSE:To dispense with a cleaning operation for removing flux after soldering so as to decrease a soldering process in manhours and to improve it in quality by a method wherein a printed board is housed in a chamber filled with non-oxidizing gas, reducing liquid is sprayed over a part to be soldered, and the part concerned is irradiated with laser rays. CONSTITUTION:A printed board 2, where a lead terminal 3A of an electronic part 3 is positioned at a prescribed pad 2A to which the terminal 3A is soldered, is housed in a chamber 1, nitrogen gas N2 is introduced into the chamber 1 through an inlet 1C via a house 23A as shown by an arrow A, reducing liquid such as glycerin or alcohol is sprayed on a solder 5 from a nozzle 4 as shown by an arrow C as supplied from a tank 22 through a hose 23B. The solder 5 is fused as irradiated with laser rays 6 to solder the lead terminal 3A to the pad 2A. |
