| 摘要 |
<p>PURPOSE:To enable a flexible wiring board provided with a semiconductor element to be effectively connected to a printed wiring board by a method wherein the semiconductor element is bonded to a recess provided to the center of the lower side of a resin solid, then the semiconductor element is connected to a wire-bonding pad, the peripheral part concerned is sealed up with resin, and furthermore the flexible wiring board is connected to the printed wiring board through the intermediary of substance which is electrically conductive in a specific direction. CONSTITUTION:A flexible wiring board 2 is set to a resin molded body 1 so as to position its outer connection terminal 5 below a protrusion 12 provided to the molded body 1, and the board 2 and the molded body 1 are bonded together with a film adhesive agent. Then, a semiconductor element 6 is bonded to a recess 11 provided to the resin molded body 1 with rubber composition, a wire 7 is ultrasonic-bonded between the semiconductor element 6 and a wire- bonding pad 4 on the flexible wiring board 2, a resin composition is injected around them to seal up the semiconductor element 6. Then, the flexible wiring board 2 and a printed wiring board 10 are connected together through the intermediary of an adhesive anisotropic conductive film 9.</p> |
