| 摘要 |
<p>PURPOSE:To improve the connection between pads and leads in degree of freedom so as to use the leads effectively by a method wherein the pads are arranged and wiring band regions are provided under the pads. CONSTITUTION:A pad 2-1 out of pads and pads 2-3 and 2-4 provided to an I/O cell are electrically connected together by wiring band regions 2-5 and 2-6 through the intermediary of contact holes or a viaholes 2-7 and 2-8. Therefore, even if a positional relation enables a lead and the I/O cell not to be connected together with a bonding wire, pads are so changed in position by the use of wiring band regions as to enable them to be easily connected together.</p> |
