| 发明名称 |
Semiconductor pellet adhesive and article made therewith. |
| 摘要 |
<p>An adhesive for bonding a semiconductor pellet to an attachment site where the adhesive is an addition reaction-curing silicone rubber composition which contain </= 500 ppm of low-molecular-weight siloxane which has a vapor pressure >/= 10 mmHg at 200 DEG C.</p> |
| 申请公布号 |
EP0432502(A2) |
申请公布日期 |
1991.06.19 |
| 申请号 |
EP19900121818 |
申请日期 |
1990.11.14 |
| 申请人 |
DOW CORNING TORAY SILICONE COMPANY, LIMITED |
发明人 |
NAKAYOSHI, KAZUMI;MINE, KATSUTOSHI |
| 分类号 |
H01L21/52;C08G77/34;C08L83/07;C09J183/00;C09J183/04;C09J183/05;C09J183/07 |
主分类号 |
H01L21/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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