Method and apparatus for mounting slice base on wafer of semiconductor.

摘要

It is known that it is advantageous in the semiconductor wafer production to re-slice a semiconductor wafer having impurity diffusion layers on the both sides processed in advance. In the re-slice process, it is required to mount a thin slice base on the periphery of semiconductor wafer prior to the re-slicing process for protecting the periphery of wafer from chipping off damage during the re-slicing process by ID saw and the like. The present invention provides several examples of method and apparatus for mounting a slice base prepared in advance on the periphery of semiconductor wafer by utilizing the method and apparatus of the present invention, in addition it further provides another method and apparatus for molding and mounting simultaneously a mold type slice base by using a thermosetting type resin on the periphery of semiconductor as the molding material, whereby the re-slice process of semiconductor wafer is extremely improved in the production cost including labor saving.