Interconnection lead having individual spiral lead design.

摘要

An interconnection lead is provided for electrically and physically connecting a plurality of bonding sites (18) on an integrated circuit (10) to a plurality of external electrical connections. The interconnection lead contains a plurality of individual electrical leads (14) which have been formed so as to each have an arcuate shape (16) at the region where each individual lead (14) is bonded to the integrated circuit (10). In addition, the arcuate shapes (16) are all of similar length and all extend in the same direction in rotation around the integrated circuit (10). This design provides enhanced strain relief during use, since the arcuate shapes (16) permit rotation of the integrated circuit (10) during mounting or excessive lead stress.