发明名称 |
Assembly of semiconductor chips |
摘要 |
A three dimensional package having at least one semiconductor chip having input/output conductive pads along its periphery includes a dielectric carrier over at least a portion of the chip and a plurality of conductors mounted on the carrier between the chip and the dielectric carrier. The plurality of conductors are mounted within the periphery of the chip with one end connected to the conductive pads and with the other end of the plurality of conductors exiting from the same side of the chip. The plurality of conductors exiting from the same side are electrically coupled to an interconnect substrate.
|
申请公布号 |
US5025306(A) |
申请公布日期 |
1991.06.18 |
申请号 |
US19880230203 |
申请日期 |
1988.08.09 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
JOHNSON, RANDALL E.;DRUMM, JAMES M. |
分类号 |
H01L23/538;H01L25/065 |
主分类号 |
H01L23/538 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|