| 摘要 |
PURPOSE:To prevent peeling between a card substrate and an over-sheet, and to reduce the manufacturing cost of an IC card by superposing the over-sheet onto the surface of the card substrate, irradiating the specified position of the over-sheet with laser beams and welding the over-sheet and the card substrate. CONSTITUTION:Both surfaces of a card substrate 11 are coated with adhesives 14, and over-sheets 15 as thermoplastic films formed of transparent polyethylene terephthalate, etc. are superposed onto both surfaces of the card substrate 11. When an IC card 20 is irradiated with laser beams 18 from the upper section of a glass plate 16 by controlling a computer, etc., laser beams are transmitted through the glass plate 16 and the over-sheet 15, and absorbed by the card substrate 11, and sections absorbing laser beams 18 are heated. The heat of a melting section 19a is conducted through the over-sheet 15, and a melting section 19b as a second melting section is shaped to the over-sheet 15. Accordingly, the adhesive strength of the over-sheets and the card substrate is increased while the over-sheets can be cladded to the card substrate without demaging the performance of an IC chip buried into the card substrate. |
