Bonding structure of an electronic device and a method for manufacturing the same

摘要

A bonding structure and a bonding method for connecting an IC unit having an insulating sheet to connecting terminals arranged on a substrate. The insulating sheet has an elongated opening which is formed along one side of said insulating sheet and has on its one surface a plurality of conductive metal leads adhered thereto which stretch over the elongated opening. Portions of the metal leads which stretch over the elongated opening are solder-plated to serve as connecting portions. The connecting portions of the metal leads are heated and pressed into the opening with use of a heat-pressing head which has a width narrower than the opening, thereby being soldered to the connecting terminals. The metal lead is formed with inclined parts at its positions corresponding to both sides of the portion depressed by the heat-pressing head and solder pools are formed between the inclined parts and the connecting terminals. A bonding structure of high efficiency and high reliability is achieved for bonding IC unit with fine-pitch connecting-leads.