| 摘要 |
<p>PURPOSE:To provide a semiconductor device capable of stable operation by mounting a chip on a lead frame with parallel tie bars, cutting the inner tie bar after inner molding, and cutting the outer tie bar after external molding. CONSTITUTION:Leads 13 of a lead frame is held by a first tie bar 31 and a second tie bar 32 that is outer and parallel with the first tie bar. When resin is injected through a gate 35 to form an inner resin 11, there appear flashes 36 between leads, and flashes 40 around the gate. Therefore, leaking resin could be blocked at hatched areas 38 before reaching soldered portions outside the package. Isolated dam blocks 38 may be provided to prevent flashes 40. After the bar 31 is cut, its edges and the flashes 36 and 40 are enclosed in external molding, and the bar 32 is cut. It is thus possible to improve the productivity and quality of a device.</p> |
