| 摘要 |
PURPOSE:To directly mount a package on a printed circuit board by fixing a flat lead having the coefficient of thermal expansion equal to that of a ceramic member to the bottom surface of the package. CONSTITUTION:A sub-carrier 14 loaded with a photoelectric transducer 2 is composed of a ceramic member and fixed to the metal plate 11 soldered to the bottom surface of a package 10 by laser welding. A hybrid IC 4 having an amplifying circuit IC 5 fixed and mounted thereon is fixed to the metal base 12 soldered to the bottom surface of the package 10 by a solder material. Further, a flat lead 13 composed of kovar (iron-Ni-Co alloy) having the coefficient of thermal expansion equal to that of the ceramic member is soldered to the package 10 so that the respective bottom surfaces of the package 10 and the flat lead 13 become the same plane. By this constitution, since the inductance parasitic on the connection part of the amplifying circuit can be reduced, the package can be directly mounted on a printed circuit board. |
