MULTILAYER BONDING METHOD FOR NOZZLE PLATE,申请号JP19890279146-传众专利搜索

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发明名称	MULTILAYER BONDING METHOD FOR NOZZLE PLATE
摘要
申请公布号	JPH03140250(A)	申请公布日期	1991.06.14
申请号	JP19890279146	申请日期	1989.10.26
申请人	SEIKO EPSON CORP	发明人	SUMI KOJI
分类号	B41J2/135;B41J2/16	主分类号	B41J2/135
代理机构		代理人
主权项
地址

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