| 摘要 |
PURPOSE:To obtain a semiconductor device wherein package cracks are hard to occur by constituting an insulating tape with a meshed tape having many holes. CONSTITUTION:A semiconductor element (chip) 6 is fixed on inner leads 4 through partially provided insulating tapes 5. The insulating tapes 5 are provided on both end sides of the chip 6 and formed of polyimide resin. A plurality of holes 7 are provided, and a meshed pattern is formed. A bonding agent comprising resin such as acrylic resin, epoxy resin and polyimide resin is applied on both surfaces. Therefore, air is hard to be contained into an interface between the insulating tapes 5 and the chip 6. The strength of the interface between the insulating tape 5 and the resin is improved. Therefore, peeling of the chip and cracks in the package are hard to occur, and the reliability of the semiconductor device can be improved.
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