Device for baking wafers or waffles - in which wafers are formed on extended flat surface which acts as lower half of baking mould

摘要

In a new device for baking wafers, etc. the outline of the upper baking mould half (1) is formed by a ring (3) which can move relative to the upper mould half (1) and which has a sealing rim (7) which projects beyond it lower edge. This ring (3) moves on insulating guides (5) on the upper mould half (1), is fixed to a support plate (4), and is provided with at least one steam vent opening (6) above the level of its rim (7). Cutting edges (8,8') are provided to trim off any baked dough which enters the openings (6). The guides (5) may be in the form of a closed sealing ring surrounding the upper mould half (1). USE/ADVANTAGE - For automatic baking of wafers or waffles. Unlike the customary baking tray or support placed between the mould halves is not needed, and this is achieved without introducing a requirement for a separate process for removing the finished item from the mould after baking.