PHOTOSENSITIVE RESIN COMPOSITION FOR FORMING CONDUCTOR PATTERN AND MULTILAYERED PRINTED CIRCUIT BOARD AND PRODUCTION THEREOF

摘要

PURPOSE:To obtain the improved resin compsn. which can form good conductor patterns by incorporating a photosetting resin, thermosetting resin and photosensitive semiconductor particles into the compsn. CONSTITUTION:The resin compsn. 10 for forming the conductor patterns is applied over the entire surface of an interlayer insulating layer 5 and is exposed with UV via a negative mask 9' for forming a 2nd conductor layer. Development is then executed to form the resin layers 10 in the form of the 2nd conductor patterns exclusive of holes 6' for via holes, hole parts 2' for through-holes and lands 4'. The surfaces of the resin layers 10 are roughened and a soln. of the salt of a metal to constitute the nucleus for plating is applied thereon and the entire surface of the resin surface is exposed to form plating catalysts 3'. Chemical plating is applied thereon to form the 2nd conductor layer 7. The resin layers 10 for forming the conductor patterns contain both components of the photosetting resin and thermosetting resin and the photosensitive semiconductor particles. The formation of the high-density conductor layers 7 is facilitated in this way without hindering the connection between the upper and lower conductor layers.