| 摘要 |
<p>PURPOSE:To mount an IC which has high mass productivity directly on a board by forming resin so that it may cover an electrically connecting part between an electrode terminal and a resin package integrated circuit and the resin package integrated circuit. CONSTITUTION:An IC 11, which is connected electrically with an electrode terminal 36 through a through hole being an opening formed by laminating a film layer 12 between an electrode terminal 3b and a metallic foil 13, and then removing one part each of the metallic foil 13 and the film layer 12, is retained on the metallic foil 13, and the electrically connecting part 16 between the electrode terminal 36 and the IC 11 and the IC are covered with molded resin 6. Hereby, the IC 11, which is sealed with resin, can be connected directly to the electrode part of a terminal board constituting the terminal part of a module arranged separately, so the module of simple structure can be obtained by simple manufacturing process.</p> |
