| 发明名称 |
Direct bonded metal-substrate structures. |
| 摘要 |
<p>A composite structure comprises a symmetric bimetallic laminate (20) bonded to a metallic or ceramic substrate (30) by a eutectic (28) or other bonding process. A variety of beneficial structures can be provided, free, for instance, of thermal coefficient of expansion mismatch.</p> |
| 申请公布号 |
EP0431725(A2) |
申请公布日期 |
1991.06.12 |
| 申请号 |
EP19900308040 |
申请日期 |
1990.07.23 |
| 申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
NEUGEBAUER, CONSTANTINE ALOIS;GLASCOCK, HOMER HOPSON, II;BURGESS, JAMES FRANCIS |
| 分类号 |
B32B15/01;B23K35/00;B32B7/02;B32B7/04;B32B15/04;C04B37/02;H01L21/48;H01L23/08;H01L23/492;H01L23/498 |
主分类号 |
B32B15/01 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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