发明名称 Integrated circuit comprising memories and method for its fabrication.
摘要 <p>The present invention relates to an integrated circuit comprising memories. The substrate on which the transistors of the memory locations are produced consists of an n<+> doped substrate (6) provided at its p<-> doped surface of small thickness converted by ion implantation into a n<-> doped layer in all the zones (9) surrounding the zone (7') in which the transistors constituting the memory locations are produced. <IMAGE></p>
申请公布号 EP0432057(A1) 申请公布日期 1991.06.12
申请号 EP19900420506 申请日期 1990.11.22
申请人 SGS-THOMSON MICROELECTRONICS S.A. 发明人 BERGEMONT, ALBERT
分类号 H01L27/10;H01L21/8242;H01L23/556;H01L27/092;H01L27/108;H01L27/11 主分类号 H01L27/10
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