| 摘要 |
PCT No. PCT/FR87/00143 Sec. 371 Date Dec. 29, 1987 Sec. 102(e) Date Dec. 29, 1987 PCT Filed Apr. 29, 1987 PCT Pub. No. WO87/06763 PCT Pub. Date Nov. 5, 1987.To encapsulate integrated circuits mounted on continuous dielectrical strips (surface-mounted circuits) it is proposed to transfer mold a thermosetting resin around circuits carried by the strip, the resin being injected outside the parting plane of the mold, contrary to the usual practice in this field. The protection of the circuits is improved while, at the same time, the ability to test the strip is preserved. |
