| 摘要 |
PURPOSE:Not only to eliminate a bump forming process but also to obtain a semiconductor device that a semiconductor board is surely connected with a wiring and the like formed on a wiring board at a very fine pad pitch smaller than that through a wire bonding method by a method wherein the wiring part of a flexible resin circuit board is sandwiched between a very fine metal piece and the semiconductor board to electrically connect the wiring to the semiconductor board. CONSTITUTION:In a semiconductor device in which an electrode pad 15 formed on a semiconductor board 11 is electrically connected with an outer wiring through a very fine metal piece 14, the connection part of a wiring 12 formed on a flexible resin circuit board 13 is connected to the electrode pad 15 as sandwiched between the electrode pad 15 and the very fine metal piece 14 connected to the electrode pad 15. For instance, copper is evaporated on a polyimide film board 13, which is patterned into a wiring 12, then a window 16 slightly larger than the semiconductor board 11 is provided to the film board 13 so as to leave only a wiring pattern unremoved. The wiring pattern of the film carrier is aligned with the electrode pad 15 formed on the board 11, and the very fine metal piece 14 is formed so as to overlap both the electrode pad 15 and the wiring 12 through the same manner with a ball bump. |
