发明名称 |
Process for encasing an electronic component |
摘要 |
The process for encasing an electrically conductive region in an electronic component in an insulating layer comprises the steps of depositing a polymer layer by electrochemical polymerization of phenol-, thiophenol- and analine-containing monomers and their combinations from an electrolytic solution on the electrically conductive region and subsequently cross-linking the polymer layer to form a chemically inert insulating layer. The process provides a uniformly adhering thin insulating layer. A field effect transistor so encased is suitable for use as a physical and/or chemical sensor. |
申请公布号 |
US5022969(A) |
申请公布日期 |
1991.06.11 |
申请号 |
US19890353072 |
申请日期 |
1989.05.15 |
申请人 |
JOSOWICZ, MIRA;POTJE-KAMLOTH, KARIN |
发明人 |
JOSOWICZ, MIRA;POTJE-KAMLOTH, KARIN |
分类号 |
G01N27/414;C25D9/02;H01L21/312;H01L21/56;H01L23/29;H01L23/31 |
主分类号 |
G01N27/414 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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