发明名称 Process for encasing an electronic component
摘要 The process for encasing an electrically conductive region in an electronic component in an insulating layer comprises the steps of depositing a polymer layer by electrochemical polymerization of phenol-, thiophenol- and analine-containing monomers and their combinations from an electrolytic solution on the electrically conductive region and subsequently cross-linking the polymer layer to form a chemically inert insulating layer. The process provides a uniformly adhering thin insulating layer. A field effect transistor so encased is suitable for use as a physical and/or chemical sensor.
申请公布号 US5022969(A) 申请公布日期 1991.06.11
申请号 US19890353072 申请日期 1989.05.15
申请人 JOSOWICZ, MIRA;POTJE-KAMLOTH, KARIN 发明人 JOSOWICZ, MIRA;POTJE-KAMLOTH, KARIN
分类号 G01N27/414;C25D9/02;H01L21/312;H01L21/56;H01L23/29;H01L23/31 主分类号 G01N27/414
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