| 摘要 |
A robotic laser soldering apparatus for automated assembly of microscopic components which is capable of acquiring, orienting, and soldering very small electrical components, such as gallium arsenide (GaAs) beam lead diodes, to a circuit board having a soft substrate. The apparatus includes a vacuum pickup means for picking up and holding the diode, pattern recognition means for determining the proper positioning of the diode on the circuit board, and a laser for soldering the diode leads.
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