| 摘要 |
PURPOSE:To enhance the precision in bonding positions by a method wherein the slippage amount of the first and second bonding points out of a reference picture image is automatically confirmed and after correcting the respective bonding positions for the slippage amount, both points are ground-bonded. CONSTITUTION:The position of the first bonding point 9a specified by ground- bonding process is decided by a leadframe 1a used in the teaching time. Thus, the slippage amount DELTAY out of the reference picture image is to be automatically confirmed by an ITV camera 3. The first bonding point 9a after the confirmation can be processed by correcting the bonding point 9a as a reference in terms of the slippage amount DELTAY. Another bonding point 10a corresponding to the first bonding point 8a can be processed together with the second bonding point 8b taking the same position correcting measures as those of the first bonding point 8a. Through these procedures, the bonding process using a wire 8 can be performed by processing the first and second bonding points 8a, 8b by taking said position correcting measures. Accordingly, any slipped position of a leadframe can be corrected with high precision. |
