| 摘要 |
<p>PURPOSE:To increase thermal conductivity and electric conductivity and relax restriction on brazing temperature, by arranging a conductor chip on a plate member of specified quality unified in a body with a frame member in a window space of the frame member formed by using material having a thermal expansion coefficient smaller than or equal to three time that of a semiconductor chip. CONSTITUTION:A semiconductor chip 27 is brazed to a composite plate member having a frame member 41 defining a window space W having a specified shaped and a plate member 42 which is inserted into the window space W and unified in a body with the frame member 41. Since copper or aluminum or alloy of either one of them is used as plate material, the thermal conductivity and electric conductivity of the composite plate material are high. Since the frame member is formed by using alloy having a thermal expansion coefficient smaller than or equal to three times that of a semiconductor chip, the thermal expansion coefficient of the plate member can be restrained, and the composite plate member exhibits high relaxing action of thermal stress. Since said composite member material can be constituted without containing sintering metal like molybudenum and carbon fiber, the cost is low, and application under high brazing temperature is enabled.</p> |
