| 摘要 |
The present invention is a package for housing microcircuit components and the method of manufacturing the same, the latter of which includes the steps of explosively bonding first and second dissimilar metals to produce a base member, machining that base member to produce a flat bottom portion with upstanding side walls defining an interior volume in the first metal, the side walls of which are surmounted by a ring formed of the second metal, whereby the said ring can be low temperature welded to a cover piece without adversely thermally affecting the metallurgical properties of the first metal.
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