| 摘要 |
PURPOSE:To ensure electric continuity between a first metal wiring and a second metal wiring, by forming an aperture part of surface protection of a bonding window, inside the level difference part of a through hole formed between multilayer metal wirings, and completely covering a metal wiring part wherein the film thickness on the through hole level difference is thin, with a protecting film. CONSTITUTION:A through hole 7 is formed in an interlayer insulating film 4 on a first metal wiring 3 formed on a silicon substrate 1; a second metal wiring 5 is formed on the insulating film 4, the wiring 3 and the second metal wiring 5 are electrically connected via the through hole 7; a step difference part of the wiring 5 formed in the through hole part 7 is covered with a protecting film 6, a bonding window 8 is formed in the protecting film part 6; that is, the protecting film 6 is arranged inside the bonding window 8. A second metal wiring part 9 wherein the film thickness of through hole side wall part is made thin is completely covered with a protecting film. Thereby the damage generated by external cause after assembling process can be prevented, so that electric continuity between the wiring 3 and the wiring 5 can be ensured.
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