发明名称 BONDING OF BONDING WIRE AND COATING APPARATUS USED THEREFOR
摘要 PURPOSE:To realize a bonding operation by which a strength of a bonding part is not changed and whose insulating performance is excellent by a method wherein a bonding part of a bonding wire is kept naked and only a part between bonding parts is coated and insulated. CONSTITUTION:After a first bonding operation, a terminal 3 for coating use is arranged in a position which protrudes a little along a wire 2 from the tip of a capillary 1 used to move the wire 2; and the wire 2 is coated. During this process, a structure where the terminal 3 for coating use can be moved by following the capillary 1 is adopted; and a required length of the wire 2 is coated, at a good response, with an insulating resin 6 as a coating material. The required length on the surface of the wire 2 between the terminal 3 and the capillary 1 is coated while a non-coating part 15 to be used as a bonding part in a second bonding operation is left; after that, the terminal 3 is made to escape to another position; the capillary 1 is left in an inner lead part; and the second bonding operation is executed.
申请公布号 JPH03135042(A) 申请公布日期 1991.06.10
申请号 JP19890273521 申请日期 1989.10.20
申请人 NIPPON STEEL CORP 发明人 ONO TAKAHIDE;TATSUMI KOHEI
分类号 H01L21/60 主分类号 H01L21/60
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