发明名称 Sputter coating apparatus - with target exchange chamber capable of being evacuated when target is to be replaced thereby avoiding removal of vacuum in coating chamber
摘要 Sputter coating apparatus consists of a vacuum chamber (1) in which the coating process takes place and a target exchange chamber which is separated from the vacuum chamber by the target electrode support surface when it is in its raised position. When the target is to be changed, a vacuum is created in the exchange chamber prior to opening the separation wall as the target electrode is lowered. USE/ADVANTAGE - The target can be frequently changed without removing the vacuum in the sputter chamber. There is no new start-up time required.
申请公布号 DE4037580(A1) 申请公布日期 1991.06.06
申请号 DE19904037580 申请日期 1990.11.26
申请人 HITACHI, LTD., TOKIO/TOKYO, JP 发明人 KAMEI, MITSUHIRO;SETOYAMA, EIJI, HITACHI, JP
分类号 C23C14/34;C23C14/56 主分类号 C23C14/34
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