VERFAHREN ZUR GALVANISCHEN DIREKTMETALLISIERUNG

摘要

The invention relates to a process for galvanic deposition on the surface of non-conductors without previously coating them with metal from chemically reductive baths for the purposes of making metal coatings or through hole-plated printed circuit boards in which the following steps are taken: pre-cleaning, possibly etching or wetting the surface to be metallised; coating the surface with an adhesion agent; adsorption of a metal compound; reduction of the metal compound to metal; galvanic metallisation.